Abstract: Heat dissipation is a drastic issue to tackle due to continued integration, miniaturization, compacting and lightning of equipment. Heat dissipaters are not only chosen for their thermal performance; but also for other design parameters that includes weight, cost and reliability, depending on application. A heat sink is a device that is used to cool many various types of electronic devices by absorbing and dissipating the heat device produces through direct contact. Heat sink works the basis of transferring heat from a high temperature source to a lower temperature source, where the lower temperature source has much greater heat capacity. The primary of this study is to experimentally obtain the performance of a wavy fin heat sink by conducting free convection test.